Advantages of paste

		T	EO tech
Development - Margin	#400 Mesh 5-6㎛	≤TTC x 1.8 (150mJ/cm2)	≤TTC x 2.8 (150mJ/cm2)
	#325 Mesh 7-7.5㎛	≤TTC 1.3 (250mJ/cm2)	≤TTC 2.2 (250mJ/cm2)
The time to reach 100μΩ∙cm at 140℃		≥50min	≥30min
TDS data

Test Condition (Detail)

Contents	Conditions	Details
Printing	• SUS #400 (Emulsion 10㎛) • Squeeze pressue 0.2Mpa	Before exposure →6.4±0.8㎛ • Snap Off 1.5mm
Printed material	• V270LTFMD5 (ITO -side) • OFSD5 (Etching -side)
Pre Dry	• 88 90℃, 10min	• Heat Circulating Oven
Exposure	• 150mJ/cm2	• 17mW/cm2
Develop	• Na2CO3 Solution 0.2wt% (30℃) in DI Water	• Pressure 0.3MPa
Post Curing	• 140℃ 30min (Oven)	• Heat Circulating Oven

TTC, Develop time, Resolution

Contents		Results
Physical Property	Color	Silver Gray
	Silver content	75.3 %
	Non volatile	87.6 %
	Viscosity (cps) (10rpm, 25℃)	16,000
After test on ITO etching side	Resistance(mΩ/□) (두께 6-6.5㎛)	• 130-150 mΩ/□ (On Etching side of OFSD5) • 115 125 mΩ/□ (On ITO Side V270LTFMD5)
	Thickness before exposure(㎛)	6.4±0.8㎛ (SUS #400)
	Adhesion	3M 610 Taping 5B
	Humidity Test 8 5℃ 85% 500h	3M 610 Taping 4B
	Hardness	2H 750g
	23℃ 3Days	• Change Rate of viscosity ＜±10% • Change Rate of Sheet resistance ＜±10%

TTC, Develop time, Resolution

Contents	ITO side	ITO Etching side
TTC	15s	15s
현상시간	35 (≥TTC 2 )	35 (≥TTC 2 )
20/20(㎛)
30/30(㎛)
40/40(㎛)

Thickness Data.

SQ Speed(mm/s)	spl_1 (10rpm 19kcps) (Ave.)
39.06	5.04 ㎛
73.31	5.85 ㎛
90.91	6.53 ㎛

0.15% TTC 20s

0.15% TTC 20s
150mJ/cm2	X1.5 No peeling	X2 No peeling	X3.0 Peeling off
200mJ/cm2	X1.5 No peeling	X2 No peeling	X3.3 Peeling off
250mJ/cm2	X1.5 No peeling	X2 No peeling	X3.5 Peeling off

0.4% TTC 12s

0.4% TTC 12s
150mJ/cm2	X1.5 No peeling	X2 No peeling	X2.9 Peeling off
200mJ/cm2	X1.5 No peeling	X2 No peeling	X3.0 Peeling off
250mJ/cm2	X1.5 No peeling	X2 No peeling	X3.1 Peeling off

Adhesion, Hardness , Realiability Test Data.

Condition		On Etching side
Adhesion 3M 610 Taping	0회
	10회(5B)
Hardness Test(2H)	750g
Adhesion 3M 610 Taping	85℃ 85% 500hr	4B